ACF Bonding Tech

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What is ACF ?

Anisotropic Conductive Film, ACF, is special materials in the fabric between the two substrates bonded. Characterized in that the electrode is connected by the conductive particles between the two substrates, such that the conductive Z-axis direction is better, but the XY direction of the conductive is insulation. So that the current can only flow from the conductive bonding direction (vertical direction), but also can avoid conduction between adjacent electrodes shorted.

異方性導電膠(Anisotropic Conductive Film；ACF)，是指在兩基材之間的佈貼合的特殊材料。其特點在於利用導電粒子連接IC晶片與基板兩者之間的電極，使得Z軸方向的導電性較好，但其XY方向的導電性卻接近絕緣。以致於電流只能從黏合方向(垂直方向)導通流動，但又同時能避免相鄰兩電極間導通短路。目前ACF常用到的例如軟式排線、Film On Glass(FOG)薄膜軟板╱玻璃貼合製程等。

ACF Bonding Tech

ACF bonding technology is the using of ACF, by hot pressing, to bond FPC on the LCD glass substrate. Integrated circuit align the tiny mark point on glass substrate, which requires a very precise positioning, so that a good connection of circuit.

ACF熱壓焊接技術是運用ACF（異方向性導電膜），通過預壓將IC或集成電路邦定(Bonding)在LCD玻璃基板上。通過對齊積體電路和玻璃基板上微小的mark點，這需要進行非常精確的定位，使線路很好的連通。

Concern of ACF Application

(1) Conductive contacts should be little higher than substrates plane, so to ensure that the conductive particles could contact the upper and lower conductive.

導電接點必須為凸出的平面結構，如此才能確保導電粒子與上、下導電接點產生較多的良好接觸。

(2) The two substrates cannot be rigid both, which one must be a soft base material. Reinforcing film or a coating film will increase its stiffness, so that the residual stress will pull the substrate itself, resulting to poor conductivity.
ACF接著的兩基材不能都是硬質的，其中有一個需為軟質基材，而且以薄、軟為佳，避免使用補強膜或覆蓋膜增加其厚度及硬挺性，如此才可避免熱壓後，因基材本身的殘餘應力拉扯，而造成導電不良。

(3) If the polarity is high and then the rough surface of the substrate, it's then easy to press, and lower temperature for bonding. Instead situation, you need to heat and pressure higher to produce good connection. The good substrates like glass, FPCB with glue, copper surface, ITO. Then the hard to use substrates such as PET, PI-film, gold surface.

若接著基材表面極性高且粗糙，則接著容易，熱壓溫度及壓力也不需太高。反之則需升溫及加壓才能產生良好接著。易接著的基材如：玻璃、有膠FPCB、銅面、ITO。難接著的基材如： PET、PI-film、金面。